OEM China China PCB Printed Circuit Board Motherboard Multilayerboard Impedance Control+Gold Finished
Re ntse re ikemiselitse ho fana ka theko ea tlholisano, lihlahisoa tse ntle haholo le litharollo tsa boleng bo holimo, ka nako e ts'oanang le phano e potlakileng bakeng sa OEM China PCB Printed Circuit Board.MotherboardMultilayerboard Impedance Control+Gold Finished, Re inehetse ho fana ka mahlale a tlhoekiso a nang le boiphihlelo le likhetho bakeng sa hau!
Re ntse re ikemiselitse ho fana ka theko ea tlholisano, lihlahisoa tse ntle haholo le litharollo tsa boleng bo holimo, ka nako e ts'oanang le ho fana ka thepa ka potlako.China PCB Board, Motherboard, Ho fihlela kajeno, re na le bareki ba tsoang lefats'eng lohle, ho kenyeletsoa USA, Russia, Spain, Italy, Singapore, Malaysia, Thailand, Poland, Iran le Iraq.Morero oa k'hamphani ea rona ke ho fana ka lihlahisoa tsa boleng bo holimo ka theko e ntle ka ho fetisisa.Re labalabela ho etsa khoebo le uena.
Tšobotsi ea Rolled Copper Foil
Li-Profiles tse Tlase tse Kolotsoeng ka Koporo ka Lehlakoreng le Letšo / Lefubelu la Matte
Tšobotsi ea Rolled Copper Foil
Nakong ea ts'ebetso ea ho futhumatsa e tlase, thepa e tla fetoha mocheso oa 145 ° C ka hare ho halofo ea hora, matla a tsitsitseng le ho thatafala ha thepa e fokotsehile, kahoo elongation e eketseha haholo, e fanang ka bolelele bo lekaneng bakeng sa hamorao. ho kobeha le ho otlolla ha LED e feto-fetohang, LED e phethiloeng ha e bonolo ho senya nakong ea mokhoa oa ho otlolla le ho khumama.
Tlhaloso
● Foil ea koporo e phekotsoeng e nang le lehlakore le khubelu la matte
● Foil e entsoeng ka koporo e tšetsoeng e nang le lehlakore le letšo la matte
● Botenya: 9um 12um 18um 22um 35um 50um 70um
● Bophara: 250~630mm, bophara bo tloaelehileng: 520mm, e ka khaola ka kopo
● Sephutheloana sa lebokose la lehong
● Sehlahisoa se lumellana le maemo a tikoloho ea ROHS
● ID: 76 mm
● Bolelele: E hlophisitsoe
● Mohlala o ka fana ka tšehetso
● Bolelele ba ho qolla bolelele ba mantlha: ho latela kopo
● Theola bophara ba ka hare le bophara bo ka ntle: joalo ka kopo
Likaroloana
● Bokhopo bo fokolang
● Ho Fetola Tenyetseha ho Phahameng
● Ts'ebetso e Ntle ea Etching
● Thepa e entsoeng ka foil e ntšo kapa e khubelu
● Foil e ntšo e na le maemo a phahameng a ho feto-fetoha ha maemo, ho ba le mahlahahlaha a tlaase le likarolo tse ntle tsa 'mele le lik'hemik'hale.
Kopo
● Etsa kopo ho FPC (Flexible Printed Circuit) masimo a sebelisa: Informatization le intelligentization;Tšimo ea lihlahisoa tse phahameng tse kang Aerospace, Lisebelisoa tsa Bongaka le lisebelisoa, Liroboto, Sistimi ea Lipuisano, Lik'homphieutha le lisebelisoa tsa elektronike tsa likoloi.
● Etsa kopo ho FCCL/ Flexible copper clad plate
● E sebelisa ho feto-fetoha ha LED, LED ea boemo bo holimo le liboto tsa potoloho ea mohala oa thekeng le likarolo tse ling tsa boemo bo holimo.
● Flexible Printed Circuit
Thepa e Tloaelehileng ea Li-Profiles tse Nyanetsoeng tse Fokotsoeng tsa Koporo e nang le Lehlakore le Letšo / Lefubelu la Matte
Karolelano | Yuniti | Mokhoa oa Teko | ||||||||||||||
Botenya ba lebitso | Um | 9 | 12 | 18um | 35um | 22um | 50um | 70um | Mokhoa oa Teko | |||||||
Boima ba Sebaka | g/m² | 80±2 | 107±3 | 160±4 | 311±5 | 196±4 | 445±5 | 623±5 | GB/T29847-2013 | |||||||
Bohloeki | % | Mets.99.97 | GB/T5121 | |||||||||||||
Bokhoakhoa ba bokaholimo | Lehlakore le benyang (Ra) | Um | Boholo.0.2 | GB/T29847-2013 | ||||||||||||
Lehlakore la matte (Rz) | Um | 0.8-1.2 | ||||||||||||||
Matla a tšepe | Rm Tloaelehileng | N/mm² | ≥370 | ≥370 | ≥370 | ≥370 | ≥370 | ≥370 | ≥370 | GB/T29847-2013 | ||||||
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Rm 180 ° C * 30min. | ≥160 | ≥160 | ≥160 | ≥170 | ≥170 | ≥170 | ≥170 | |||||||||
Elongation | Tloaelehileng | % | ≥1.0 | ≥1.0 | ≥1.0 | ≥1.0 | ≥1.0 | ≥1.0 | 1≥1.0 | GB/T29847-2013 | ||||||
180°C*30min | ≥7 | ≥7 | ≥8 | ≥11 | ≥9 | ≥13 | ≥20 | |||||||||
Matla a Peel | N/mm | ≥0.8 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.0 | ≥1.4 | ≥2.0 | GB/T29847-2013 | |||||||
Boleng ba Sefahleho | / | 'Mala o Tšoanang, Ha ho Lesoeba, Ha ho Mokokotlo, Ha ho Mokoti le Ntlha e Bohlokoa | ||||||||||||||
Khanyetso ea Lik'hemik'hale | % | Max.5 | ||||||||||||||
Khahlano le Oxidation | 200°C/60min | E sa tlose mmala | Q/TBJB004-2015 | |||||||||||||
Solder Resistance |
| 300°C/20s Ha ho mahlaseli |
Sehlahisoa se fihlile ho maemo a tikoloho a ROHS.
Ts'ebetso ea Li-Profiles tse tlase tse Robisitsoeng ka Koporo ka Balck/Red Iamge
Re ntse re ikemiselitse ho fana ka theko ea tlholisano, lihlahisoa tse ntle haholo le litharollo tsa boleng bo holimo, ka nako e ts'oanang le ho tsamaisoa ka potlako bakeng sa OEM China China PCB Printed Circuit Board Motherboard Multilayerboard Impedance Control+Gold Finished, Re 'nile ra inehela ho fana ka tlhoekiso e nang le boiphihlelo. thekenoloji le likhetho bakeng sa hau!
OEM ChinaChina PCB Board, Motherboard, Ho fihlela kajeno, re na le bareki ba tsoang lefats'eng lohle, ho kenyeletsoa USA, Russia, Spain, Italy, Singapore, Malaysia, Thailand, Poland, Iran le Iraq.Morero oa k'hamphani ea rona ke ho fana ka lihlahisoa tsa boleng bo holimo ka theko e ntle ka ho fetisisa.Re labalabela ho etsa khoebo le uena.