Lesela la Koporo le Tlase (LP -SP/B)

Botenya: 12um 15um 18um 35um 70um 105um

Standard Width: 1290mm, e ka khaola joalo ka kopo ea boholo

Sephutheloana sa lebokose la lehong


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Lintlha

Botenya: 12um 18um 25um 35um 50um 70um 105um
Standard Width: 1290mm, e ka khaola joalo ka kopo ea boholo
Sephutheloana sa lebokose la lehong
ID: 76 limilimithara, 152 limilimithara
Bolelele: E hlophisitsoe
Mohlala o ka fanoa

Likaroloana

Foil ena e sebelisoa haholo-holo bakeng sa li-PCB tse nang le li-multilayered le liboto tsa potoloho tse phahameng, tse hlokang hore bokaholimo ba foil bo be tlase ho feta bo tloaelehileng ba koporo e le hore litšoantšiso tsa bona tse kang ho phunya ho hanyetsa li ka lula li le boemong bo phahameng.Ke ea sehlopha se ikhethileng sa foil ea koporo ea electrolytic e nang le taolo e thata.Ha ho bapisoa le foil e tloaelehileng ea koporo ea electrolytic, likristale tsa LP foil ea koporo ke lijo-thollo tse ntle haholo tse lekanang (<2/zm).Li na le likristale tsa lamellar ho e-na le li-columnar, ha li ntse li e-na le mapheo a bataletseng le boemo bo tlaase ba holimo.Li na le melemo e kang botsitso ba boholo bo betere le boima bo phahameng.

Boemo bo tlase ba FCCL
MIT e phahameng
Etchability e babatsehang
Foil e phekotsoeng e pinki kapa e ntšo

Kopo

3 lera FCCL
EMI

Lintho tse tloaelehileng tsa Low Profile Copper Foil (LP -SP/B)

Karolelano

Yuniti

Tlhokahalo

Mokhoa oa Teko

Botenya ba lebitso

Um

12

18

25

35

50

70

105

IPC-4562A

Boima ba Sebaka

g/m²

107±5

153±7

225±8

285±10

435±15

585±20

870±30

IPC-TM-650 2.2.12.2

Bohloeki

%

≥99.8

IPC-TM-650 2.3.15

makgwakgwa

Lehlakore le benyang (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Lehlakore la matte(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Matla a tšepe

RT(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

HT(180°C)

≥138

Elongation

RT(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

HT(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Rsestivity

Ω.g/m²

≤0.17 0

≤0.1 66

 

≤0.16 2

 

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Matla a Peel(FR-4)

N/mm

≥1.0

≥1.3

 

≥1.6

 

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Nomoro

 

 

No

IPC-TM-650 2.1.2

Mohanyetsi-oxidization RT(23°C) Days

 

 

180

 
HT(200°C) Metsotso

 

 

30

 

Bophara bo Tloaelehileng, 1295 (± 1) limilimithara, bophara ba bophara: 200-1340mm.May ho ea ka moreki kopo serōki.

5G High frequency Board Ultra Low Profile Copper Foil1

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona