Matte Side Treated Low Profiles Rolled Copper foil Black le mmala o mofubelu
Li-Profiles tse Tlase tse Kolotsoeng ka Koporo ka Lehlakoreng le Letšo / Lefubelu la Matte
Tšobotsi ea Rolled Copper Foil
Nakong ea ts'ebetso ea ho futhumatsa e tlase, thepa e tla fetoha mocheso oa 145 ° C ka hare ho halofo ea hora, matla a tsitsitseng le ho thatafala ha thepa e fokotsehile, kahoo elongation e eketseha haholo, e fanang ka bolelele bo lekaneng bakeng sa hamorao. ho kobeha le ho otlolla ha LED e feto-fetohang, LED e phethiloeng ha e bonolo ho senya nakong ea mokhoa oa ho otlolla le ho khumama.
●The tšoaroa phuthoa koporo foil le khubelu matte lehlakoreng
●Foil ea koporo e phekotsoeng e nang le lehlakore le letšo la matte
●Botenya: 9um 12um 18um 22um 35um 50um 70um
●Bophara: 250 ~ 630mm, bophara bo tloaelehileng: 520mm, e ka khaola ka kopo
●Sephutheloana sa lebokose la lehong
●Sehlahisoa se fihlile ho litekanyetso tsa tikoloho tsa ROHS
●ID: 76 limilimithara
●Bolelele: E hlophisitsoe
●Mohlala o ka fana ka tšehetso
●Roll Length an core length: ho latela kopo
●Rola bophara bo ka hare le bophara bo ka ntle: joalo ka kopo
●Bokhopo bo tlase
●Ho Fetolana ho Phahameng
●Ts'ebetso e Ntle ea Etching
●The tšoaroa foil e ntšo kapa khubelu
●Foil e ntsho e na le maemo a phahameng a ho feto-fetoha ha maemo, makgwakgwa a tlase mme a na le thepa e ntle ya mmele le ya dikhemikhale.
●Etsa kopo ho FPC (Flexible Printed Circuit) masimo a sebelisa: Informatization le intelligentization;Tšimo ea lihlahisoa tse phahameng tse kang Aerospace, Lisebelisoa tsa Bongaka le lisebelisoa, Liroboto, Sistimi ea Lipuisano, Lik'homphieutha le lisebelisoa tsa elektronike tsa likoloi.
●Etsa kopo ho FCCL/ Flexible copper clad plate
●Etsa kopo ea ho feto-fetoha ha LED, LED e feto-fetohang e phahameng le liboto tsa potoloho ea mohala oa thekeng le likarolo tse ling tsa boemo bo holimo.
●Flexible Printed Circuit
| Karolelano | Yuniti | Mokhoa oa Teko | ||||||||||||||
| Botenya ba lebitso | Um | 9 | 12 | 18um | 35um | 22um | 50um | 70um | Mokhoa oa Teko | |||||||
| Boima ba Sebaka | g/m² | 80±2 | 107±3 | 160±4 | 311±5 | 196±4 | 445±5 | 623±5 | GB/T29847-2013 | |||||||
| Bohloeki | % | Mets.99.97 | GB/T5121 | |||||||||||||
| Bokhoakhoa ba bokaholimo | Lehlakore le benyang (Ra) | Um | Boholo.0.2 | GB/T29847-2013 | ||||||||||||
| Lehlakore la matte (Rz) | Um | 0.8-1.2 | ||||||||||||||
| Matla a tšepe | Rm Tloaelehileng | N/mm² | ≥370 | ≥370 | ≥370 | ≥370 | ≥370 | ≥370 | ≥370 | GB/T29847-2013 | ||||||
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| Rm 180 ° C * 30min. | ≥160 | ≥160 | ≥160 | ≥170 | ≥170 | ≥170 | ≥170 | |||||||||
| Elongation | Tloaelehileng | % | ≥1.0 | ≥1.0 | ≥1.0 | ≥1.0 | ≥1.0 | ≥1.0 | 1≥1.0 | GB/T29847-2013 | ||||||
| 180°C*30min | ≥7 | ≥7 | ≥8 | ≥11 | ≥9 | ≥13 | ≥20 | |||||||||
| Matla a Peel | N/mm | ≥0.8 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.0 | ≥1.4 | ≥2.0 | GB/T29847-2013 | |||||||
| Boleng ba Sefahleho | / | Mobala o Uniform,Ha ho Wrinkle,Ha ho Scratch,Ha ho Sekoti le Ntlha e Bohlokoa | ||||||||||||||
| Khanyetso ea Lik'hemik'hale | % | Max.5 | ||||||||||||||
| Khahlano le Oxidation | 200°C/60min | E sa tlose mmala | Q/TBJB004-2015 | |||||||||||||
| Solder Resistance |
| 300°C/20s Ha ho mahlaseli | ||||||||||||||
Sehlahisoa se fihlile ho maemo a tikoloho a ROHS.
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