Low Profile Reverse Reverse Copper Foil Bakeng sa ho tjhaja Wireless
●Botenya: 12um 18um 35um 50um 70um
●Standard Width: 1290mm, e ka khaola ho ea ka kopo ea boholo
●Sephutheloana sa lebokose la lehong
●ID: 76 limilimithara, 152 limilimithara
●Bolelele: E hlophisitsoe
●Boemo bo tlase ba FCCL
●MIT e phahameng
●Etchability e babatsehang
●Foil e phekotsoeng e pinki kapa e ntšo
●Fetola foil ea koporo e phekotsoeng
●Ha e na arsenic, e tala
●2 lera FPC
●EMI
●Mohala oa mohala Ho tjhaja ka waelese
| Karolelano | Yuniti | Tlhokahalo | Mokhoa oa Teko | |||||
| Botenya ba lebitso | Um | 12 | 18 | 35 | 50 | 70 | IPC-4562A | |
| Boima ba Sebaka | g/m² | 107±5 | 153±7 | 285±10 | 435±15 | 585±20 | IPC-TM-650 2.2.12.2 | |
| Bohloeki | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||
| makgwakgwa | Lehlakore le benyang (Ra) | սm | ≤3.0 | IPC-TM-650 2.3.17 | ||||
| Lehlakore la matte(Rz) | um | ≤3.0 | ≤4.0 | ≤6.0 | ≤8.0 | ≤10 | ||
| Matla a tšepe | RT(23°C) | Mpa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | |||
| HT(180°C) | ≥103 | ≥138 | ||||||
| Elongation | RT(23°C) | % | ≥4 | ≥4 | ≥8 | ≥10 | ≥12 | IPC-TM-650 2.4.18 |
| HT(180°C | ≥4 | ≥4 | ≥6 | ≥8 | ≥8 | |||
| Matla a Peel(FR-4) | N/mm | ≥0.7 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.3 | IPC-TM-650 2.4.8 | |
| Lbs/ka | ≥4.0 | ≥4.6 | ≥5.7 | ≥6.9 | ≥7.4 |
| ||
| Pinholes & Porosity | Lipalo | No | IPC-TM-650 2.1.2 | |||||
| Mohanyetsi-oxidization | RT(23°C) | Days | 180 | |||||
| HT(200°C) | Metsotso | 60 | ||||||
Bophara bo Tloaelehileng, 1295 (±1) limilimithara, bophara ba bophara: 200-1340mm.May ho ea ka moreki kopo serōki.
