Ka lehlakoreng le leng le phekola foil ea koporo bakeng sa HDI

●Botenya: 12um 18um 35um

●Bophara ba naha: 1290, re ka bata joalo ka tlhokahalo ea boholo

●Id: 76 mm, 152 mm


Lintlha tsa sehlahisoa

Li-tag tsa lihlahisoa

TLHOKOMELISO

●Botenya: 12um 18um 35um
●Bophara ba naha: 1290, re ka bata joalo ka tlhokahalo ea boholo
●Id: 76 mm, 152 mm
●Bolelele: E ratoang
●Sampul e ka ba fage; Nako ea lead: Matsatsi a 7
●Nako ea ho tsamaisa: 15-20
●Lintlha tsa ho paka: Lebokose la patsi ea kantle ho naha
●Poleloana: fob, cif.
●Ntho ea tefo: 50% T / TT Deposit, e leka-lekana pele ho thepa.
●Lisebelisoa tse phahameng tsa ts'ebetso ea ts'ebetso ea ho etsa lintho tse sebetsang ho etsa ts'ebetso ea molomo oa koporo.

Likaroloana

●Mekhoa ea koro e sebelisoang habeli
●E nang le matla a phahameng a tlatsang ho laminate
●Polaishene e tobileng ea sebaka
●Ho Etletsoa Hantle
●Fori e phehiloeng e pinki

Kopo

●Multillayer e hatisitsoeng ea potoloho ea potoloho
●HdI (HDIity Density Interconnector) bakeng sa PCB

Thepa e tloaelehileng ea siling e lekiloeng ea koporo bakeng sa HDI

Classified

Yuniti

TLHOKOMELISO

Mokhoa oa liteko

Foil ha e rapele

 

T

H

1

2

IPC-4562a

Botenya ba lebitso

um

12

18

35

70

IPC-4562a

Boima ba sebaka

G / M²

107±5

153± 7

285 ± 10

585± 20

IPC-TM-650 2.2.12

Bohloeki

%

≥99.8

IPC-TM-650 2.3.15

ROughness

Lehlakoreng le leng (Ra)

um

≤3.0

IPC-TM-650 2.2.17

Matte lehlakoreng (rz)

um

≤6

≤8

≤10

≤15

Matla a tšepe

Rt (23 ° C)

Mpa

≥207

≥207

≥276

≥276

IPC-TM-650 2.4.18

H.T. (180° C)

≥103

≥103

≥138

≥138

Emplation

Rt (23 ° C)

%

≥2

≥2

≥3

≥3

IPC-TM-650 2.4.18

H.T. (180° C)

≥2

≥2

≥2

≥3

TLHOKOMELISO

Ωg /m²

≤0.170

≤0.166

≤0.162

≤0.162

IPC-TM-650 2.5.14

Matla a peel (FR-4)

Lehlakoreng

N / mm

≥0.9

≥0.9

≥1.4

≥1.4

IPC-TM-650 2.4.8

Lbs / ho

≥5.1

≥6.3

≥8.0

≥8.0

Lehlakoreng la m

N / mm

≥0.9

≥1.1

≥1.4

≥2.0

Lbs / ho

≥5.1

≥6.3

≥8.0

≥11.4

Pinholes le Porosity

Palos

No

IPC-TM-650 2.1.2

Anti-oxidization

Rt (23 ° C)

Matsatsi

180

/

H.T. (200° C)

Metsotso

40

/

Bophara ba naha, 1295 (± 1) MM ea bophara: 200graphmmmm. May ho latela kopo ea bareki ea moreki.
Setšoantšo sa PCB Coil Setšoantšo sa Filper

Ka lehlakoreng le leng le phekola foil ea koporo bakeng sa HDI3
Ka lehlakoreng le leng le phekola foil ea koporo bakeng sa HDI4

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa oa hau mona 'me u e romelle ho rona