5G Electrolytic Copper Foil

Botenya: 12um 18um 35um

Bophara: 300-1300mm.bophara ba stadnard 1290mm, e ka itšeha joalo ka tlhoko ea boholo

Sephutheloana sa lebokose la lehong


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso

Botenya: 12um 18um 35um
Bophara: 300-1300mm.bophara ba stadnard 1290mm, e ka itšeha joalo ka tlhoko ea boholo
Sephutheloana sa lebokose la lehong
ID: 76 limilimithara, 152 limilimithara
Bolelele: E hlophisitsoe
Mohlala o ka fanoa
Delivery: 10-20days
Slitting Working Procedure: Etsa slitting, classification, hlahloba le sephutheloana ho ea ka tlhokahalo ea boleng, bophara le boima ba lifola tsa koporo tsa bareki.

Likaroloana

Boemo bo tlase haholo, bo nang le peel e phahameng
Matla le etchability e ntle
Theknoloji ea ho roala holimo e tlase

Kopo

5G High frequency board
LCP/MPI/MTPI

Thepa e Tloaelehileng ea 5G Electrolytic Copper Foil

Karolelano

Yuniti

Tlhokahalo

Mokhoa oa Teko

Tlhaloso ea Foil

 

T

H

1

IPC-4562A

Botenya ba lebitso

um

12

18

35

IPC-4562A

Boima ba Sebaka

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12

Bohloeki

%

≥99.8

IPC-TM-650 2.3.15

Rbohlasoa

Lehlakore le benyang (Ra)

um

0.43

IPC-TM-650 2.2.17

Lehlakore la matte(Rz)

um

1.0

mokhoa oa optical

Matla a tšepe

RT(23°C)

Mpa

300

IPC-TM-650 2.4.18

H.T.(180°C)

180

Elongation

RT(23°C)

%

5

6

8

IPC-TM-650 2.4.18

H.T.(180°C)

6

6

6

Matla a Peel(FR-4)

N/mm

0.6

0.6

0.6

IPC-TM-650 2.4.8

Lbs/ka

3.4

3.4

3.4

Li-pinholes le porosity

Nomoros

No

IPC-TM-650 2.1.2

Mohanyetsi-oxidization

RT(23°C)

Matsatsi

90

 

H.T.(200°C)

Metsotso

40

 

Bophara bo Tloaelehileng, 1295 (±1) limilimithara, bophara ba bophara: 200-1340mm.May ho ea ka moreki kopo serōki.

5G Electrolytic Copper Foil1

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona