Hyper Haholo Profile Foil ea Koporo Bakeng sa Dijithale tse lebelo le phahameng

Botenya: 12um 18um 35um

Bophara bo Tloaelehileng: 1290mm, Max.bophara - 1340 limilimithara;e ka khaola ho latela boholo ba kopo

Sephutheloana sa lebokose la lehong


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Likaroloana

Boemo bo tlase haholo bo nang le matla a phahameng a peel le bokhoni bo botle ba etch
Sebelisa thekenoloji ea Low coarsening, microstructure e etsa hore e be lisebelisoa tse ntle haholo ho sebelisoa ho potoloho ea phetisetso ea maqhubu a phahameng
Foil e phekotsoeng e pinki

Tšebeliso e tloaelehileng

Potoloho ea phetiso ea maqhubu a phahameng
Seteishene sa motheo/Seva
Ditsitithale tsa lebelo le phahameng
PPO/PPE

Litšobotsi tse Tloaelehileng tsa Hyper Ho Foil ea Koporo ea boemo bo tlase haholo

Karolelano

Yuniti

Mokhoa oa Teko

Test Mokhoa

Botenya ba lebitso

Um

12

18

35

IPC-4562A

Boima ba Sebaka

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Bohloeki

%

≥99.8

IPC-TM-650 2.3.15

Boqhobane

Lehlakore le benyang (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Lehlakore la matte(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

 

Matla a tšepe

RT(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

HT(180°C)

≥180

≥180

≥180

 

Elongation

RT(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

HT(180°C)

≥6

≥6

≥6

 

Pinholes & Porosity

Nomoro

No

IPC-TM-650 2.1.2

Peel Matla

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Mohanyetsi-oxidization

RT(23°C)

Matsatsi

90

 

RT(200°C)

Metsotso

40

 
5G High frequency Board Ultra Low Profile Copper Foil1

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona