Hyper Haholo Ho Tlase Profile Copper Foil Bakeng sa High Speed ​​Transmission

Slitting Working Procedure: Etsa slitting, classification, hlahloba le sephutheloana ho ea ka tlhokahalo ea boleng, bophara le boima ba lifola tsa koporo tsa bareki.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

JIMA Copper proprietary ultra low roughness treatment process e etsa bonnete ba hore matla a ho khomarela ka matla bakeng sa thepa ea filimi e tlaase ea Dk, eo matla a ho khomarela ho leng thata ho e finyella, ntle le ho tela thepa ea phetisetso.Ka lebaka la foil ea motheo e ntlafalitsoeng, e boetse e fana ka litšoaneleho tse phahameng tsa ho khumama bakeng sa ho kenya letsoho molokong o latelang oa lipotoloho tse bonolo tse hatisitsoeng.

Lintlha

Botenya: 12um 18um 35um
Standard Width: 1290mm, e ka khaola joalo ka kopo ea boholo.
Sephutheloana sa lebokose la lehong
ID: 76 limilimithara, 152 limilimithara
Bolelele: E hlophisitsoe
Mohlala o ka fanoa
Nako ea ho tsamaisa: 15-20days
Lisebelisoa tse phahameng tse nepahetseng tsa ho itšeha li khaola lifolakha tsa koporo ho latela bophara bo hlokoang ke bareki.
Slitting Working Procedure: Etsa slitting, classification, hlahloba le sephutheloana ho ea ka tlhokahalo ea boleng, bophara le boima ba lifola tsa koporo tsa bareki.

Likaroloana

Boemo bo tlase haholo, bo nang le peel e phahameng
Matla le etchability e ntle
Theknoloji e tlase ea mahoashe

Kopo

Ditsitithale tsa lebelo le phahameng
Seteishene sa motheo/seva
PPO/PPE
Sebelisa thekenoloji ea Low coarsening, microstructure e etsa hore e be lisebelisoa tse ntle haholo ho sebelisoa ho potoloho ea phetisetso ea maqhubu a phahameng.
High frequency transmission circuit / High Speed ​​Transmission.

Thepa e Tloaelehileng ea Hyper haholo e tlase Profile ea Copper Foil

Karolelano

Yuniti

Tlhokahalo

Mokhoa oa Teko

Tlhaloso ea Foil

 

T

H

1

IPC-4562A

Botenya ba lebitso

um

12

18

35

IPC-4562A

Boima ba Sebaka

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12

Bohloeki

%

≥99.8

IPC-TM-650 2.3.15

Rbohlasoa

Lehlakore le benyang (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Lehlakore la matte(Rz)

um

1.5-2.0

mokhoa oa optical

Matla a tšepe

RT(23°C)

Mpa

300

IPC-TM-650 2.4.18

H.T.(180°C)

180

Elongation

RT(23°C)

%

5

6

8

IPC-TM-650 2.4.18

H.T.(180°C)

6

6

6

Matla a Peel(FR-4)

N/mm

0.6

0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/ka

3.4

4.6

5.7

Li-pinholes le porosity

Nomoros

No

IPC-TM-650 2.1.2

Mohanyetsi-oxidization

RT(23°C)

Matsatsi

90

 

H.T.(200°C)

Metsotso

40

 

Bophara bo Tloaelehileng, 1295 (± 1) limilimithara, bophara ba bophara: 200-1340mm.E se eka ho ea ka kopo ea moreki serōki.

5G High frequency Board Ultra Low Profile Copper Foil1

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona