Ultra Low Profile Copper Foil Bakeng sa 5G High frequency Board

●Botenya: 12um 18um 35um

●Bophara bo Tloaelehileng: 1290mm, Max.bophara 1340mm;e ka khaola ho latela boholo ba kopo

●Sephutheloana sa lebokose la lehong

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Foil e tala, e nang le bokaholimo bo benyang bo nang le bokhopo bo tlase haholo mahlakoreng ka bobeli, e alafshoa ka mokhoa oa JIMA Copper proprietary micro-roughening ho fihlela ts'ebetso e phahameng ea ankora le bokhopo bo tlase haholo.E fana ka ts'ebetso e phahameng maemong a mangata a fapaneng, ho tloha libotong tse thata tse hatisitsoeng tsa potoloho tse etelletsang pele thepa ea phetisetso le ho etsa mohlala o motle ho lipotoloho tse hatisitsoeng tse feto-fetohang tse etelletsang pele pepeneneng.

Likaroloana

●Boemo bo tlase ba Ultra bo nang le matla a phahameng a peel le bokhoni bo botle ba ho etch.
●Theknoloji ea Hyper Low coarsening, microstructure e etsa hore e be lisebelisoa tse ntle haholo ho sebelisoa ho potoloho ea phetisetso ea maqhubu a phahameng.
●Foil e phekotsoeng e pinki.

Tšebeliso e tloaelehileng

●Potoloho ea phetiso ea maqhubu a phahameng
●Seteishene sa motheo/Seva
●Ditsitithale tsa lebelo le phahameng
●PPO/PPE

Thepa e Tloaelehileng ea Ultra Low Profile Copper Foil

Karolelano		Yuniti	Mokhoa oa Teko			Test Mokhoa
Botenya ba lebitso		Um	12	18	35	IPC-4562A
Boima ba Sebaka		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Bohloeki		%	≥99.8			IPC-TM-650 2.3.15
Boqhobane	Lehlakore le benyang (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Boqhobane	Lehlakore la matte(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Matla a tšepe	RT(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Matla a tšepe	HT(180°C)	Mpa	≥180	≥180	≥180
Elongation	RT(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	HT(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Nomoro	No			IPC-TM-650 2.1.2
Peel Matla		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Matla		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Mohanyetsi-oxidization	RT(23°C)	Matsatsi	90
Mohanyetsi-oxidization	RT(200°C)	Metsotso	40