Electrolytic Copper Foil Bakeng sa High Speed Digital
●Botenya: 12um 18um 35um
●Standard Width: 1290mm, e ka khaola joalo ka kopo ea boholo.
●Sephutheloana sa lebokose la lehong
●ID: 76 limilimithara, 152 limilimithara
●Bolelele: E hlophisitsoe
●Mohlala o ka fanoa
●Nako ea ho tsamaisa: 10-20days
●Thepa e ntle e ntle haholo lefatšeng ka bophara: JIMA Copper e na le lisebelisoa tsa boleng ba machaba ba lihlahisoa tsa koporo tsa electrolytic le lisebelisoa tsa tlhahlobo le tlhahlobo e nepahetseng.Mechini le lisebelisoa tse tsoetseng pele tsa malapeng le tsa mose ho maoatle bakeng sa tlhahiso, ts'ebetso, ho paka le ho hlahloba foil ea koporo ea electrolytic li tla hlahisoa khafetsa hammoho le katoloso ea sekala le nts'etsopele ea khoebo ea k'hamphani.
●Boemo bo tlase haholo, bo nang le peel e phahameng
●Matla le etchability e ntle
●Theknoloji e tlase ea mahoashe
●Ditsitithale tsa lebelo le phahameng
●Seteishene sa motheo/seva
●PPO/PPE
Karolelano | Yuniti | Tlhokahalo | Mokhoa oa Teko | ||||
Tlhaloso ea Foil |
| T | H | 1 | IPC-4562A | ||
Botenya ba lebitso | um | 12 | 18 | 35 | IPC-4562A | ||
Boima ba Sebaka | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12 | ||
Bohloeki | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||
Rbohlasoa | Lehlakore le benyang (Ra) | um | ≤0.43 | IPC-TM-650 2.2.17 | |||
Lehlakore la matte(Rz) | um | 1.0-1.5 | |||||
Matla a tšepe | RT(23°C) | Mpa | ≥300 | IPC-TM-650 2.4.18 | |||
H.T.(180°C) | ≥180 | ||||||
Elongation | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 | |
H.T.(180°C) | ≥6 | ≥6 | ≥6 | ||||
Matla a Peel(FR-4) | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | ||
Lbs/ka | ≥3.4 | ≥4.6 | ≥5.7 | ||||
Li-pinholes le porosity | Nomoro | No | IPC-TM-650 2.1.2 | ||||
Mohanyetsi-oxidization | RT(23°C) | Matsatsi | 90 |
| |||
H.T.(200°C) | Metsotso | 40 |
Bophara bo Tloaelehileng, 1295 (±1) limilimithara, bophara ba bophara: 200-1340mm.May ho ea ka moreki kopo serōki.