E tlase e nang le matla a bopina a phehiloeng foli ea coil ea electrolytic
●Botenya: 12um 18um 35um 75um 105um
●Bophara ba naha: 1290, e ka khaola ka kopo ea boholo
●Sephutheloana sa mapolanka
●Id: 76 mm, 152 mm
●Bolelele: E ratoang
●Sampole e ka fana ka faele
●Ho Nchafatsa Carwon: Jima Copper ke mofuta o le mong oa litaba tse ncha, 'me u rekisoe le ho reka ka thepa Phokotso.
●Ho fetola foil ea koporo ea koporo
●Boemo bo tlase
●High Mit
●Ho Etletsoa Hantle
●Fori e phehiloeng e pinki
●Multilayer Board
●Khahla e Phahameng
●EMI
Classified | Yuniti | TLHOKOMELISO | Mokhoa oa liteko | ||||||
Botenya ba lebitso | um | 12 | 18 | 35 | 70 | 105 | IPC-4562a | ||
Boima ba sebaka | G / M² | 107±5 | 153± 7 | 285 ± 10 | 585± 20 | 870±30 | IPC-TM-650 2.2.12 | ||
Bohloeki | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
ROughness | Lehlakoreng le leng (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
Matte lehlakoreng (rz) | um | ≤5.0 | ≤6.0 | ≤8.0 | ≤10 | ≤12. | |||
Matla a tšepe | Rt (23 ° C) | Mpa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | ||||
H.T. (180° C) | ≥103 | ≥138 | |||||||
Emplation | Rt (23 ° C) | % | ≥2 | ≥2 | ≥3 | ≥3 | ≥4 | IPC-TM-650 2.4.18 | |
H.T. (180° C) | ≥2 | ≥2 | ≥2 | ≥3 | ≥3 | ||||
Matla a peel (FR-4) | N / mm | ≥0.7 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.4 | IPC-TM-650 2.4.8 | ||
Lbs / ho | ≥4.0 | ≥4.6 | ≥5.7 | ≥7.4 | ≥8.0 | ||||
Pinholes le Porosity | Palos | No | IPC-TM-650 2.1.2 | ||||||
Anti-oxidization | Rt (23 ° C) | Matsatsi | 180 |
| |||||
H.T. (200° C) | Metsotso | 40 |
Bophara ba naha, 1295 (± 1) MM ea bophara: 200graphmmmm. May ho latela kopo ea bareki ea moreki.
