Lehlakore le Habeli le Tšoaroang ka Copper foil Bakeng sa HDI
●Botenya: 12um 18um 35um 70um
●Bophara bo Tloaelehileng: 1290mm, Re ka khaola joalo ka tlhoko ea boholo
●ID: 76 limilimithara, 152 limilimithara
●Bolelele: E hlophisitsoe
●Mohlala o ka fanoa;Nako ea ho tsamaisa: matsatsi a 7
●Nako ea ho fana: 15-20days
●Lintlha tsa ho paka: Export Wooden box
●Nako: FOB, CIF.
●Ntho ea tefo: 50% T / T deposit, tefo ea tekanyo pele e romeloa.
●Lisebelisoa tse phahameng tsa ts'ebetso ea ts'ebetso ea ts'ebetso li etsa ts'ebetso ea maiketsetso ea foil ea koporo.
●Foil ea koporo e nang le mahlakore a mabeli
●Ka matla a phahameng a tlamang ho laminate
●Lamination e otlolohileng ka mekhahlelo e mengata
●Etchability e ntle
●Foil e phekotsoeng e pinki
●Multilayer Printed Circuit Board
●HDI (High Density Interconnector) bakeng sa PCB
Karolelano | Yuniti | Tlhokahalo | Mokhoa oa Teko | ||||||
Tlhaloso ea Foil |
| T | H | 1 | 2 | IPC-4562A | |||
Botenya ba lebitso | um | 12 | 18 | 35 | 70 | IPC-4562A | |||
Boima ba Sebaka | g/m² | 107±5 | 153±7 | 285±10 | 585± 20 | IPC-TM-650 2.2.12 | |||
Bohloeki | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
Rbohlasoa | Lehlakore le benyang (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
Lehlakore la matte(Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
Matla a tšepe | RT(23°C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
H.T.(180°C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
Elongation | RT(23°C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
H.T.(180°C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
Ho hanyetsa | Ωg/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | |||
Matla a Peel(FR-4) | S lehlakore | N/mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
Lbs/ka | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
M lehlakore | N/mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
Lbs/ka | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
Li-pinholes le porosity | Nomoros | No | IPC-TM-650 2.1.2 | ||||||
Mohanyetsi-oxidization | RT(23°C) | Matsatsi | 180 | / | |||||
H.T.(200°C) | Metsotso | 40 | / |
Bophara bo Tloaelehileng, 1295 (± 1) limilimithara, bophara ba bophara: 200-1340mm.May ho ea ka moreki kopo serōki.
Setšoantšo sa PCB Copper Foil