Ka lehlakoreng le leng le phekola foil ea koporo bakeng sa HDI

Botenya: 12um 18um 35um

Bophara ba naha: 1290, re ka bata joalo ka tlhokahalo ea boholo

Id: 76 mm, 152 mm


Lintlha tsa sehlahisoa

Li-tag tsa lihlahisoa

TLHOKOMELISO

Botenya: 12um 18um 35um
Bophara ba naha: 1290, re ka bata joalo ka tlhokahalo ea boholo
Id: 76 mm, 152 mm
Bolelele: E ratoang
Sampul e ka ba fage; Nako ea lead: Matsatsi a 7
Nako ea ho tsamaisa: 15-20
Lintlha tsa ho paka: Lebokose la patsi ea kantle ho naha
Poleloana: fob, cif.
Ntho ea tefo: 50% T / TT Deposit, e leka-lekana pele ho thepa.
Lisebelisoa tse phahameng tsa ts'ebetso ea ts'ebetso ea ho etsa lintho tse sebetsang ho etsa ts'ebetso ea molomo oa koporo.

Likaroloana

Mekhoa ea koro e sebelisoang habeli
E nang le matla a phahameng a tlatsang ho laminate
Polaishene e tobileng ea sebaka
Ho Etletsoa Hantle
Fori e phehiloeng e pinki

Kopo

Multillayer e hatisitsoeng ea potoloho ea potoloho
HdI (HDIity Density Interconnector) bakeng sa PCB

Thepa e tloaelehileng ea siling e lekiloeng ea koporo bakeng sa HDI

Classified

Yuniti

TLHOKOMELISO

Mokhoa oa liteko

Foil ha e rapele

 

T

H

1

2

IPC-4562a

Botenya ba lebitso

um

12

18

35

70

IPC-4562a

Boima ba sebaka

G / M²

107±5

153± 7

285 ± 10

585± 20

IPC-TM-650 2.2.12

Bohloeki

%

≥99.8

IPC-TM-650 2.3.15

ROughness

Lehlakoreng le leng (Ra)

um

3.0

IPC-TM-650 2.2.17

Matte lehlakoreng (rz)

um

6

8

10

15

Matla a tšepe

Rt (23 ° C)

Mpa

207

207

276

276

IPC-TM-650 2.4.18

H.T. (180° C)

103

103

138

138

Emplation

Rt (23 ° C)

%

2

2

3

3

IPC-TM-650 2.4.18

H.T. (180° C)

2

2

2

3

TLHOKOMELISO

Ωg /m²

0.170

0.166

0.162

0.162

IPC-TM-650 2.5.14

Matla a peel (FR-4)

Lehlakoreng

N / mm

0.9

0.9

1.4

1.4

IPC-TM-650 2.4.8

Lbs / ho

5.1

6.3

8.0

8.0

Lehlakoreng la m

N / mm

0.9

1.1

1.4

2.0

Lbs / ho

5.1

6.3

8.0

11.4

Pinholes le Porosity

Palos

No

IPC-TM-650 2.1.2

Anti-oxidization

Rt (23 ° C)

Matsatsi

180

/

H.T. (200° C)

Metsotso

40

/

Bophara ba naha, 1295 (± 1) MM ea bophara: 200graphmmmm. May ho latela kopo ea bareki ea moreki.
Setšoantšo sa PCB Coil Setšoantšo sa Filper

Ka lehlakoreng le leng le phekola foil ea koporo bakeng sa HDI3
Ka lehlakoreng le leng le phekola foil ea koporo bakeng sa HDI4

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