Hyper Haholo Profile Copper Foil Bakeng sa High speed digital
●Boemo bo tlase haholo bo nang le matla a phahameng a peel le bokhoni bo botle ba etch
●Sebelisa thekenoloji ea Low coarsening, microstructure e etsa hore e be lisebelisoa tse ntle haholo ho sebelisoa ho potoloho ea phetisetso ea maqhubu a phahameng
●Foil e phekotsoeng e pinki
●Potoloho ea phetiso ea maqhubu a phahameng
●Seteishene sa motheo/Seva
●Ditsitithale tsa lebelo le phahameng
●PPO/PPE
| Karolelano | Yuniti | Mokhoa oa Teko | Test Mokhoa | |||
| Botenya ba lebitso | Um | 12 | 18 | 35 | IPC-4562A | |
| Boima ba Sebaka | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12.2 | |
| Bohloeki | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
| Boqhobane | Lehlakore le benyang (Ra) | սm | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
| Lehlakore la matte(Rz) | um | 1.5-2.0 | 1.5-2.0 | 1.5-2.0 |
| |
| Matla a tšepe | RT(23°C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
| HT(180°C) | ≥180 | ≥180 | ≥180 |
| ||
| Elongation | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
| HT(180°C) | ≥6 | ≥6 | ≥6 |
| ||
| Pinholes & Porosity | Nomoro | No | IPC-TM-650 2.1.2 | |||
| Peel Matla | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
| Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
| Mohanyetsi-oxidization | RT(23°C) | Matsatsi | 90 |
| ||
| RT(200°C) | Metsotso | 40 | ||||
