5G Electrolytic Copper Foil

●Botenya: 12um 18um 35um

●Bophara: 300-1300mm.bophara ba stadnard 1290mm, e ka itšeha joalo ka tlhoko ea boholo

●Sephutheloana sa lebokose la lehong

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso

●Botenya: 12um 18um 35um
●Bophara: 300-1300mm.bophara ba stadnard 1290mm, e ka itšeha joalo ka tlhoko ea boholo
●Sephutheloana sa lebokose la lehong
●ID: 76 limilimithara, 152 limilimithara
●Bolelele: E hlophisitsoe
●Mohlala o ka fanoa
●Delivery: 10-20days
●Slitting Working Procedure: Etsa slitting, classification, hlahloba le sephutheloana ho ea ka tlhokahalo ea boleng, bophara le boima ba lifola tsa koporo tsa bareki.

Likaroloana

●Boemo bo tlase haholo, bo nang le peel e phahameng
●Matla le etchability e ntle
●Theknoloji ea ho roala holimo e tlase

Kopo

●5G High frequency board
●LCP/MPI/MTPI

Thepa e Tloaelehileng ea 5G Electrolytic Copper Foil

Karolelano			Yuniti	Tlhokahalo			Mokhoa oa Teko
Tlhaloso ea Foil				T	H	1	IPC-4562A
Botenya ba lebitso			um	12	18	35	IPC-4562A
Boima ba Sebaka			g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12
Bohloeki			%	≥99.8			IPC-TM-650 2.3.15
Rbohlasoa	Lehlakore le benyang (Ra)		um	≤0.43			IPC-TM-650 2.2.17
	Lehlakore la matte(Rz)		um	1.0			mokhoa oa optical
Matla a tšepe	RT(23°C)		Mpa	≥300			IPC-TM-650 2.4.18
	H.T.(180°C)			≥180
Elongation	RT(23°C)		%	≥5	≥6	≥8	IPC-TM-650 2.4.18
	H.T.(180°C)			≥6	≥6	≥6
Matla a Peel(FR-4)			N/mm	≥0.6	≥0.6	≥0.6	IPC-TM-650 2.4.8
			Lbs/ka	≥3.4	≥3.4	≥3.4
Li-pinholes le porosity			Nomoros	No			IPC-TM-650 2.1.2
Mohanyetsi-oxidization		RT(23°C)	Matsatsi	90
		H.T.(200°C)	Metsotso	40